Equipment

• Maximum Operating Pressure: 18000 psi
• Operating Flow Rate Range: ≤ 2.0 mL/min
• Column: 2.1 x 150 mm
• Pump: Binary
• Sample Conditions: 4–40 °C
• Solvent Conditions: Active Pre-heating
• PDA Wavelength Range: 190–500 nm

• Output Power: 1000 W
• Output Voltage: 0–120 V
• Output Current: 0–10 A

• Connected to Gear Pump
• Radiation Window: Quartz Glass
• Effective Area of Lighting Source: 1 / 5 / 10 cm²
• Electrodes: Titanium Mesh and Boron-Doped Diamond
• Sealing Gaskets: from Viton™ Rubber

Setup for anodization of various metals (with different anodization cells)

• Measurement of magnetic hysteresis loops for soft and hard magnetic materials
• Temperature range: RT–1000 K
• Magnetic field up to 2.3 T
• In-situ measurements in different atmospheres
• Manual sample positioning and control software

• Complete setup for powder preparation and consolidation under Ar atmosphere
• Integrated Jet Mill for controlled particle-size reduction
• SPS Furnace for rapid sintering with precise temperature and pressure control
• Enables contamination-free processing of reactive or rare-earth-based materials

• For operation in high vacuum, Ar, or H₂ atmosphere
• Maximum temperature: 1200 °C
  Programmable heating and cooling cycles
• Ideal for alloy annealing and degassing processes

• Horizontal furnace for controlled heat treatments
• Maximum temperature: 1200 °C
• Equipped with programmable temperature controller
• Suitable for sintering, calcination, and reduction reactions

• Automated particle-size separation
• Range: 23 µm to 500 µm
• Adjustable vibration amplitude and timer control
• Stainless steel sieve set for metallic and ceramic powders

• High-temperature furnace for electrochemical experiments
• Temperature up to 1200 °C
• Compatible with inert or reducing atmospheres
• Configured for solid-state ionic and catalytic studies

• High-sensitivity magnetic characterization for small samples
• Field range up to 1.8 T
• Angle adjustment option for in-situ studies
• User-friendly software interface for quick data analysis

• Measurement of hysteresis loops for hard magnetic materials
• Magnetic field up to 2 T
• Determination of coercivity, remanence, and maximum energy product
• Suitable for bulk magnets and sintered compacts

• Generation of pulsed magnetic fields up to 6 T
• Configurable pulse strenght
• Used for magnetization of permanent magnets and alignment of powder compacts

• Readability: 0.000001 g (6 decimal places)
• Maximum capacity: 220 g
• Built-in draft shield and static elimination system
• Calibrated for high-precision magnetic powder weighing

• Multi-directional sample mixing for homogeneous powder blends
• Adjustable mixing speed and duration
• Compatible with various container sizes
• Ensures uniform powder distribution before pressing or sintering

• Horizontal furnace for heat treatment of samples
• Maximum temperature: 1200 °C
• Controlled atmosphere capability
• Ideal for oxidation, reduction, and sintering steps

• Rapid solidification system with copper spinning wheel
• Wheel speed up to 40 Hz
• Maximum melt temperature: 1800 °C
• Produces amorphous or nanocrystalline ribbons

• Melting of up to 6 samples simultaneously (1 cm³ each)
• Controlled atmosphere operation (vacuum or Ar)
• Water-cooled copper hearth
• Ideal for preparation of intermetallic alloys and master alloys

• Combined magnetic field and pressure-assisted consolidation in polymers
• Magnetic field up to 300 mT
• Maximum temperature: 300 °C
• Pressure up to 5 T
• Used for magnet alignment and densification during pressing

• Cs corrected STEM unit and detectors
• JEOL Centurio 100 mm2 EDXS detector
• Gatan Quantum GIF EELS spectrometer
• Digital CCD Cameras (ULTRASCAN and ORIUS)

• JED 2300 EDXS detector
• Gatan CCD camera ORIUS
• Analytical holders (single tilt, double tilt)
• Cooling and heating holders (double tilt)

• In-Lens Thermal FEG
• SEI, LEI detectors
• BE detectors (RIBE, RBEI)
• INCA Oxford 350 EDS SDD (20mm2)
• INCA Wave 500 spectrometer
• XENOS XeDraw 2 e-lithograph
• EBSD, Channel 5, Oxford Instruments
• r-filter for contaminating SE in BE signals
• Prechamber

•  Objective Carl Zeiss Plan S 1.0x, FWD 81 mm
• Binocular 455044-9901
• Light source CL 1500 ECO, goose-neck flexible light guides
• Canon Power Shot A640
• Software AxioVision 4.6

• Liquid-cell device optimized for ex-situ electrochemical measurements

• Continuous flow liquid-cell holder compatible with JEOL2100 and JEOL ARM200CF TEMs
• In-situ liquid heating and electrochemical analysis with simultaneous TEM imaging/diffraction and analytical data collection
• Integrated solutions for static-mode analysis and liquid mixing experiments
• Optimized for EDXS analysis

• differential pumping for three vacuum modes (HiVac, LoVac and ESEM mode)
• W thermionic source
• huge chamber, for 16 samples and 65nm movement in the Z axis
• Nav-Cam
• IR CCD camera
• ETD in the chamber
• CBSD on the objective lens
• LFD for LoVac
• GSED for ESEM mode
• two PLA apertures (EDS v LoVac)
• EDS, Oxford Instruments, AZtec Live, Ultim

• Accelerating voltages: 300, 100, 80, 60 keV
• X-FEG/Monochromator
• Ceta M camera
• Cs S-CORR corrector
• Super-X EDXS system
• Continuum S/1077 60-300keV GIF EELS spectrometer
• Lorentz lens
• 4D STEM pixelated detector EMPAD

• Schottky FEG with a monochromator
• piezo stage movement
• automatic prechamber
• Nav-Cam inside the chamber
• IR CCD camera
• ETD in the chamber
• TLD in the column
• MD in the column for BSE
• ICD in the column for BSE
• DBS in the chamber for BSE
• STEM 3+ (BF, DF, HAADF)
• EDS, Oxford Instruments, AZtec Live, Ultim Max SDD 65 mm² 

• Noise Level: < 0.5Å RMS in vertical (Z) dimension with acoustic/vibration isolation
• Microscope: DimensionTM SPM Head
• X-Y imaging area approx. 90µm square
• Z range approx. 6µm
• Lateral accuracy typically within 1%, maximum 2%
• Provides full 16-bit resolution on all axes for all scan sizes and offsets
• Sample Size: Up to 150mm diameter and up to 12mm thick
• Optical microscope: 150µm to 675µm horizontal viewing area, Motorized zoom and focus, Resolution 1.5µm
• Scanning techniques: Contact Mode, TappingMode, Non-contact Mode, LiftModeTM, PhaseImagingTM (patented), Magnetic Force Microscopy (MFM)

• WELL, S.A.
• For precision cutting of TEM samples

• For the preparation of TEM specimens
• For produce circular dimples (spherical or flat-bottomed profile) in material such as ceramics, semiconductors, metals, and combinations thereof

• on beam etching and coating system for advanced SEM sample preparation, with ultra thin conductive coatings

• For enhance sample quality and high-resolution TEM results
• PIPS sample cooling option
• CCD imaging system for real-time video imaging

• TECHNOORG LINDA
• For endpolishing of TEM samples based on a low energy ion source

• BAL-TEC Limited
• For etchining of TEM samples based on a high energy ion source

• Grinding and polishing of material samples in preparation for microscopy.
• The equipment is able to control the force applied, fluid rate dispensed, and platen speed (50 – 500 rpm)

• ALLIED, High Tech Products, Inc.
• Mechanical sample preparation of TEM and SEM samples

• Ultra-low-energy, inert-gas ion source
• Concentrated ion beam with scanning capabilities
• Removes damaged layers without redeposition

• RPM range: 100-975
• Cutting Capacity: 50.00 mm
• Cut Action: Gravity Fed Chop

• Balzers
• For SEM sample preparation

• Dimension (LxBxH) internal (mm): 954x605x587
• Laminar flow speed 0.35 m/s, laminar flow rate 669 m³/h
• Filters HEPA H14 filters according to EN 1822: efficiency of 99.995% MPPS and 99.999 % DOP
• UV light and fans with timer

• Programmable using software Tiamo
• 20 and 50 ml dosing unit 800 Dosino
• 802 Rod Stirrer with 804 Ti stand
• pH meter

• Maximum temperature: 2400 °C
• Atmosphere: air, Ar, vacuum

• Filament Sizes: 1.75mm and 2.85mm
• Material Capacity: Hopper: 3195.5 cm³, Screw Void:8 cm³, Feed Port: 3195.5 cm³
• Extrudable Plastics: PLA, ABS, PC, PP, PS, ULTEM, PEEK, NYLON, HDPE, PETG, and WAX
• Temperature Control: 4 Independently PID controlled heat zones, all with active fan cooling for consistent heating

• Puller Wheel Torque: 5 Nm
• Filament Diameter Range:5mm to 3.5mm
• Variable speed control with speed control knob
• 43.18 cm L x 24.13 cm H x 18.42cm W

• Chamber volume: 24 L
• Internal dimensions: φ294 x 350mm
• Heating power: 2.2 kW
• Admissible working pressure: 3.5 bar
• Admissible working temperature: 138 deg

• Range: 70–800 MPa
• Stroke: 200 mm
• Section: 49087 mm²
• Max Load: 1963 kN

• Capable to determine expansion and shrinkage curve, coefficient of thermal expansion, glass transition temperature and dilatometric softening point
• Up to 1750 °C
• Heating rates up to 30 °C/min

• SINTER SPS SYNTEX 3000
• Pressure: 100 kN
• Pressure: 5 kN
• Sintering Temperature: 2500 °C
• Sintering DC Pulse Generator Max. Output: 3,000 A

• Mixing, homogenizing and dispersing viscous materials by shear force between the rolls

• Preparation of feedstocks with high torque and temperature
• Dimensions (W x H x D):700 x 870 x 950 mm
• Torque deviation:± 0,15 %
• Speed: 0.2 to 185 min^-1

• Freezedrying of frozen samples
• Solvent: water, cyclohexane, diluted alcohols
• Chamber volume: 6.5 L
• Condensator temperature: -85 °C
• Sample temperature: approximately -35 °C
• Vacuum: 1×10^-3 mbar

• Used for grinding
• Speed: 400 rpm
• time: 99 h
• Different jar sizes available
• W x H x D: 836 x 1220 (1900) x 780 mm

• For characterization of nanoparticles and microparticles

• Additive manufacturing of filaments
• Build Volume: 25 ×21×21 cm
• Layer height: 0.05 – 0.35 mm
• hot end/heat bed temperature: 300 °C / 120 °C

• Large XL – Built chamber (up to 700mm x 500mm x 400mm)
• High friction feeding dual-print head with 2 nozzles
• Extruder temperature up to 450°C
• Suitable for most of commercially available filaments, used also for ceramic and magnetic filaments
• Layer thickness from 0.05 mm

• Used for printing ceramic suspensions
• Control unit (MDC 3290+)
• High precision valve based on a piezoelectric element (MDV 3280)
• Multifunctional controller (MFC universal)

• Lithography-based Ceramic Manufacturing
• Lateral resolution: 40µm
• Layer thickness: 10 – 100µm
• Dimensions (L x W x H): 1.05 x 0.85 x 1.78m

• Range: 0.02-2000 μm

• Analysis stations: 2
• Measurement types: B.E.T., STSA, adsorption isotherm, desorption isotherm
• Surface area range:01 m²/g
• Pore size range: 0.35 to >400 nm
• Minimum pore volume: 2.2 x 10^-6 ml/g

• Measuring both particle size and zeta potential in solution
• Effective range for particle sizing is 2nm – 3um
• Measurements can be made in a variety of media

• Measurement of rheological properties
• Plate on plate and cone on plate geometries available
• RheoCompass software
• Max. temperature: 200 °C

• Measuring range: 0.01 to 0.1 Kpa (140); 0.1 to 400 Kpa (440)
• Accuracy: Better than 0.2%
• Pore size (diameter): 116 – 3.8 µ (140); 15 – 0.0036 µ (440)
• Particle size (diameter): 330 – 15 µ (140); 40 – 0.01 µ (440)
• Volume detection system: Capacitive
• sample size for solid materials (d x h): 12×40 mm
• detection volume: 0.5 cc
• Volume resolution: 0.0001 cc

• Measures:
  • Resonant frequency
  • Damping or Internal Friction
  • Young’s modulus
  • Shear modulus
  • Poisson ratio
• Working temperature: room temperature
• Atmosphere: air

Smallest smartphone potentiostat

USB-C connection
Potential range: -1,7 V to +2 V
Current ranges: 100 nA to 5 mA
Ideal for mobile sensor applications

Type of techniques available for the instrument to run:

• voltammetric techniques (Linear Sweep Voltammetry (LSV), Cyclic Voltammetry (CV)),
• pulsed techniques (Differential Pulse Voltammetry (DPV), Square Wave Voltammetry (SWV)),
• amperometric techniques (Chronoamperometry (CA), Chronocoulometry (CC)),
• galvanostatic techniques (Open Circuit Potential (OCP)),
• Electrochemical Impedance Spectroscopy (EIS).

Small and wireless potentiostat

USB or Wireless Bluetooth connection
Potential range: ±5 V
Current ranges: 1 nA to 10 mA or 100 mA
Ideal for mobile sensor applications

Type of techniques available for the instrument to run:

• voltammetric techniques (Linear Sweep Voltammetry (LSV), Cyclic Voltammetry (CV)),
• pulsed techniques (Differential Pulse Voltammetry (DPV), Square Wave Voltammetry (SWV)),
• amperometric techniques (Chronoamperometry (CA), Chronocoulometry (CC)),
• galvanostatic techniques (Open Circuit Potential (OCP)),
• potentiostatic/galvanostatic Impedance spectroscopy (EIS/GEIS).

High-performance potentiostat/galvanostat designed for fast, low current measurements.

Max current: ±600 mA
Current Ranges: 11 (60 pA – 600 mA)
Min Voltage Resolution: 20 aA
Max Applied Potential: ± 11 V
Min Potential Step: 12.5 μV

Type of techniques available for the instrument to run:

• physical electrochemistry (cyclic voltammetry, chronoamperometry, and chronopotentiometry),
• pulse voltammetry (pulse voltammetry, square wave voltammetry, and associated stripping techniques)
• DC corrosion (polarization resistance, potentiodynamic, cyclic polarization, and galvanic corrosion)

USB and battery-powered Potentiostat/Galvanostat/EIS analyzer

Potential range: ±5 V
FRA / EIS: 10 μHz up to 1 MHz
9 current ranges: 100 pA to 10 mA
Bluetooth or USB connection

Type of techniques available for the instrument to run:

• voltammetric techniques (Linear Sweep Voltammetry (LSV), Cyclic Voltammetry (CV)),
• pulsed techniques (Differential Pulse Voltammetry (DPV), Square Wave Voltammetry (SWV)),
• amperometric techniques (Chronoamperometry (CA), Chronocoulometry (CC)),
• galvanostatic techniques (Chronopotentiometry (CP), Open Circuit Potential (OCP)),
• potentiostatic/galvanostatic Impedance spectroscopy (EIS/GEIS).

Small and wireless two-channel potentiostat

USB-C or Wireless Bluetooth connection
Potential range: -1,7 V to +2 V
Current ranges: 100 nA to 5 mA
Ideal for mobile sensor applications

Type of techniques available for the instrument to run:

• voltammetric techniques (Linear Sweep Voltammetry (LSV), Cyclic Voltammetry (CV)),
• pulsed techniques (Differential Pulse Voltammetry (DPV), Square Wave Voltammetry (SWV)),
• amperometric techniques (Chronoamperometry (CA), Chronocoulometry (CC)),
• galvanostatic techniques (Open Circuit Potential (OCP)),
• Electrochemical Impedance Spectroscopy (EIS).

• Lights: simulated solar light, UVC 264 nm, etc.
• Temperature range: -10 to 100 °C

offers clean working conditions and protects from contamination of particles from the environment (dust free chamber). The cabinet is manufactured according to requirements of SIST EN 12469:2000 standard.

for deposition of a uniform film, of high precision and nanometric thickness, on the surface of a ceramic, metal, glass or polymer substrate.

• Wavelength range: 175 nm – 3300 nm
• Light source: tungsten-halogen and deuterium
• Detectors: photomultiplier R6872 for high energy in the entire UV/Vis wavelength range and high performance Peltier-cooled PbS detector for the NIR wavelength range

• For preparation of unilamellar vesicles
• Vesicle size controlled by polycarbonate membrane selection

• Excitation Wavelength
• Red: 640 nm, Blue: up to 495 nm
• Emission Wavelength
• Red: 660 to 720nm, Blue: 510 to 580nm
• Sensitivity: 50pg/ml dsDNA
• Use of 0.5ml PCR tubes.

• (model WiseTherm WHM 12112 from Witeg Labortechnik GmbH) with temperature controller (J-KEM, model 310) and J-type Teflon thermocouple

• Manually adjustable rotation speed of 20 to 280 rpm
• 1 L receiving and evaporating flasks
• Angle adjustable 0 – 35 °
• Heating Power 1300 W
• Controlled temperature range 20 – 95 °C
• Temperature regulation accuracy ± 2 °C

• For fast and precise water content determination
• For samples with water content between 1 ppm and 5%

• IR resolution: 320×240 pixels
• Thermal sensitivity/NETD: < 0.06°C
• Image modes: Thermal MSX, Thermal, Picture-in-picture, Thermal blending
• Object temperature range: -20°C to + 250°C (accuracy ±2°C),
• focus free

• System for photo-thermal experiments
• Laser Power range: 0-6W, adjustable
• Operating mode: continuous wave, wavelength 808 ±3 nm
• spot size (1-20mm)
• Temperature monitoring with J-type thermocouple connected to a computer (contact mode) or thermal camera (contactless mode, Flir E8)